contacts@hytekeurope.com

01285 659349

i n t r o d u c t i o n

Hytek europe has been involved with diamond grinding wheel applications in the microelectronics industry for over 35 years.  Manufacturing began in 1980 and has expanded on a rapid basis since that time.  We  supply major companies world-wide with our ultra thin resin bonded diamond & cbn dicing blades.  

Fast deliveries minimise the need for customers to hold large inventory.  We guarantee one months requirement will always be in stock and ready for despatch for orders on monthly call off.

As a small privately owned company we will respond very quickly to an enquiry - providing sample grinding wheels for evaluation on  projects. Many applications are proprietary and non-disclosures are standard.

c o m p a n y

We began producing diamond wheels in 1980 after direct experience of operating dicing machines and therefore we have great insight and knowledge of the manufacturing environment and it’s challenges. Hytek europe is the only European manufacturer of ultra thin resin bond super abrasive wheels with production capacity for fast deliveries.

Our on-going R & D programme ensures that improvements in composition and wheel performance are passed on to our customers.

Consistent performance on dicing-scribing and slotting is essential to the cost and quality of our customers’ products. Hytek has made that commitment to serve the needs of industry with a resin bonded dicing blade of exacting and repeatable performance.