a p p l i c a t i o n s :
Loadpoint’s NanoAce dicing machine
The photo on the left shows a typical application of scribing 99.6% alumina substrate.
The alumina is mounted on a tape ring - held on a vacuum chuck and scribed with a
diamond wheel of 0.20mm thickness.
Photograph courtesy of CBL Ceramics Ltd, Milford Haven
The photographs on the right show a typical application
Images courtesy of Loadpoint.
Loadpoint develop flexible dicing machines, specialising in research & development,
tailored to customer requirements. Range includes 300 mm wafer capacity, up to 30
mm thick components, very high precision grinding equipment & cleaning stations.