manufacturers of ultra thin resin bonded diamond & CBN dicing blades

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01285 659349

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Ferrite

Rare Earth Magnets
Silicon Carbide

Silicon Nitride
Tool Steels
Ceramic I/C -packages
Fibre Optics
Lithium Niobate
Tungsten Carbide
Glass fibre Circuit boards

Aluminium Titanium carbide

 

a p p l i c a t i o n s :

Loadpoint’s NanoAce dicing machine

The photo on the left shows a typical application of scribing 99.6% alumina substrate.

 

The alumina is mounted on a tape ring - held on a vacuum chuck and scribed with a diamond wheel of 0.20mm thickness.

 

Photograph courtesy of CBL Ceramics Ltd, Milford Haven

The photographs on the right show a typical application

www.loadpoint.co.uk
Loadpoint’s MicroAce dicing machine

QFN

Calcium Titanate
Sapphire - silicon on sapphire

Alumina - thick & thin film
Zirconia
Quartz

Silicon
Glass
Beryllia
Silicon / Pyrex composites
Steatite

Images courtesy of Loadpoint.

 

Loadpoint develop flexible dicing machines, specialising in research & development, tailored to customer requirements. Range includes 300 mm wafer capacity, up to 30 mm thick components, very high precision grinding equipment & cleaning stations.