Hytek europe has been involved with diamond grinding wheel applications in the microelectronics
industry for over 35 years. Manufacturing began in 1980 and has expanded on a rapid
basis since that time. We supply major companies world-wide with our ultra thin
resin bonded diamond & cbn dicing blades.
Fast deliveries minimise the need for customers to hold large inventory. We guarantee
one months requirement will always be in stock and ready for despatch for orders
on monthly call off.
As a small privately owned company we will respond very quickly to an enquiry - providing
sample grinding wheels for evaluation on projects. Many applications are proprietary
and non-disclosures are standard.
c o m p a n y
We began producing diamond wheels in 1980 after direct experience of operating dicing
machines and therefore we have great insight and knowledge of the manufacturing environment
and it’s challenges. Hytek europe is the only European manufacturer of ultra thin
resin bond super abrasive wheels with production capacity for fast deliveries.
Our on-going R & D programme ensures that improvements in composition and wheel performance
are passed on to our customers.
Consistent performance on dicing-scribing and slotting is essential to the cost and
quality of our customers’ products. Hytek has made that commitment to serve the needs
of industry with a resin bonded dicing blade of exacting and repeatable performance.
need sample dicing blades for evaluation? click here to send us your requirements......